Product description
I provided by the Secretary of the translucent membrane of silicon double from the PCB, and hardware and software combination plate FPC production has been widely used. As hands parade stacked purposes, failed to pressure (0) to the application of high pressure (1500 PSI) and temperatures up to 204C (400 F).
This product specifications: 25 µ m of Si -
Typical Applications: Lamination of PCB¡¢FPC & Rigid-Flex Printed Board , and highly performance.
|
Physical |
Units |
Parameter |
|
Tensile Strength MD |
PSI |
25,000 |
|
Tensile Strength TD |
PSI |
30,000 |
|
Elongation at Break MD |
% |
90 |
|
Elongation at Break TD |
% |
60 |
|
Yield Strength MD |
PSI |
14,000 |
|
Yield Strength TD |
PSI |
14,000 |
|
Thermal |
Units |
Parameter |
|
Shrinkage MD (190¡æ) |
% |
2.8 |
|
Shrinkage TD (190¡æ) |
% |
0 |
|
Melt Point |
¡æ |
260 | |
